According to the latest rumors, the iPhone 7 will be even thinner and lighter compared to the iPhone 6s, with a Korean website discussing technical details on how Apple could save space within the smartphone to achieve such a feat.
ETNews claims that Apple is planning to utilize a new fan-out packaging technology for iPhone 7's radio frequency chip and antenna switching module. The technology will allow for more I/O terminals while reducing chip size.
Apple is said to be the first smartphone manufacturer that will be applying the technology, which will be used alongside single-chip EMI shields to be able to fit more components into one package without causing signal loss. The technology, which pulls out the wiring of I/O terminals to outside the chip, will also help in reducing cases of wireless communication interference.
To save space, the radio frequency chip, which is located inside the antenna switching module, will include a pair of chips in a single package instead of having two chips built into one printed circuit board.
The use of fan-out packaging technology for the iPhone 7 is the latest in the already-busy rumor mill for Apple's next flagship smartphone.
A recently leaked image apparently revealed that the iPhone 7 will have a 7.04 watt-hour battery, which is an improvement compared to the 6.61 watt-hour battery of the iPhone 6s. In comparison, however, the iPhone 6 had a 7.01 watt-hour battery.
There is no information on the voltage for the iPhone 7 though, which means that no exact charge capabilities can be discerned from the leak.
Another recent rumor involves what is said to be the first real image of the iPhone 7 Plus. The picture shows that the iPhone 7 Plus will have a dual-lens camera housed in a protruding closure, a LED flash and microphone alongside the dual-lens camera, Smart Connector support and repositioned antenna bands.
It could not be seen from the images if the iPhone 7 will indeed do away with the 3.5mm headphone jack in favor of the Lightning connector.
