TSMC Budgets 30K to 35K Wafers for 3nm Process Tech Ahead of 2nm Chips

Ahead of its 2nm chips, TSMC is budgeting 30 thousand to 35 thousand wafers for its 3nm process technology. With that, the company's upcoming 3nm chips could be good news for Apple processors.

TSMC is Planning to Manufacture 30-35k Wafers for Its 3nm Process Technology

As per DigiTimes Asia, the company is now planning to manufacture 30 thousand to 35 thousand wafers through its "3nm process technology." The new technology is set to power Apple's iPads first, according to Wccftech.

Although the iPads are expected to be the first Apple devices to use this technology, no specific models have been announced to the public as of press time. This means that the 3nm chips could first be used in any iPad model.

3nm Chips Expected to Run 40 Cores with Four Dies

The Apple iPhone, iPad, and Macs are expected to be the first few Apple models to use the M3 and A17 chips. According to the story by TechRadar, the new chips are expected to offer Apple products with improved battery life and more.

Previous rumors have pointed to the 3nm chips potentially allowing up to 40 cores with four dies. This is in contrast to the eight-core Apple M1 chip and the M1 Pro and M1 Max having up to eight cores.

The Risk of Making Faulty Batches for the 3nm Chips

The new report is supported by other rumors that are concerning the "3nm chip production schedule" by TSMC. As per TechRadar, however, there was earlier troubling news that suggested that Apple might be having chip production issues.

When it comes to the semiconductor production process, however, it can be tricky due to the likelihood of faulty batches being a side effect of the manufacturing process. Although there could still be a remedy for faulty batches, having too many mistakes could still be disastrous.

What Would Happen if the 3nm Process Won't Work Out

TechRadar notes that the faulty batches can still be repurposed for lower-powered chips to avoid wastage. With the still ongoing semiconductor shortage, TSMC has been able to command a high position when it comes to the semiconductor industry.

Should TSMC not be able to successfully master the 3nm process, the results could impact AMD, NVIDIA, and other long-time customers of the chip manufacturing company. Should the companies not be able to gain access to TSMC's upcoming 3nm chips, they would have to "rely on 5nm tech instead."

Read Also: [RUMOR] Millions of iPhone Units Could Be Lost If Shanghai Lockdown Continues; What's the Status of China?

3nm Chips Expected to Launch in 2023 with 2nm Components to Launch in 2026

According to PhoneArena, the 3nm chips are expected to launch in 2023, with 2nm components expected to ship later on in 2026. As per TSMC's top executive, the company's N2 development is now on track which includes its "new transistor structure," which is going along with the company's expectations.

The company announced that by 2024, the company will be entering "risk production," where it will see the start of production for its 2nm processors known as N2.

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Written by Urian B.

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