Researchers from the Tokyo Institute of Technology and the National Institute of Information and Communications Technology (NICT) in Japan have developed a groundbreaking wireless chipset that achieves unprecedented data transmission speeds.
This new D-band CMOS transceiver chipset has set a world record with a staggering speed of 640 Gbps.
A 45nm process 300mm silicon wafer is displayed at a press conference as Intel Japan announces the launch of the new 45nm process microprocessors, Xeon processor for servers and Core2 Extreme processors for desktop PC, in Tokyo 13 November 2007. The new processors have improved power efficiency and performance compared with current 65nm processors. AFP PHOTO / Yoshikazu TSUNO YOSHIKAZU TSUNO/AFP via Getty Images
Faster and More Efficient Wireless Chipset
The new chipset operates within the D-band frequency range of 110 to 170 GHz, far higher than the current high-band 5G systems, which function between 24 and 47 GHz.
This jump to higher frequency bands is crucial to meet the growing demand for faster and more efficient wireless systems. However, higher frequencies also mean increased signal attenuation, posing a challenge that the researchers had to overcome.
Fabricated using the 65nm silicon Complementary Metal-Oxide-Semiconductor (CMOS) process, the new chipset is not only powerful but also cost-effective, making it suitable for large-scale production.
"Notably, the world's highest wireless transmission rate of 640 Gbps is achieved using low-cost CMOS technology," stated Professor Kenichi Okada from Tokyo Tech.
A Closer Look: Technical Specifications and Components
The chipset comprises both transmitting and receiving integrated circuits (ICs). The transmitter IC measures 1.87 mm x 3.30 mm, while the receiver IC is slightly smaller at 1.65 mm x 2.60 mm.
These compact sizes belie the sophisticated technology housed within. Key components include power amplifiers for elevating signal levels, low-noise amplifiers for boosting signal strength while minimizing noise, frequency converters (mixers) for adjusting signals to the desired frequency range, distributed amplifiers for enhancing linearity, and frequency multipliers for quadrupling the frequency.
In simpler terms, this tiny but powerful chipset has the potential to significantly improve wireless technology. It can lead to smaller, more capable devices with better performance, longer battery life, and broader compatibility with different wireless standards.
Impressive Performance in Testing
To assess its capabilities, the chipset was mounted on a printed circuit board and connected to an external antenna, ensuring minimal signal loss through efficient conversion. In testing, the chipset exhibited outstanding performance, maintaining high linearity even for complex modulation schemes.
At a close range, the system achieved a transmission speed of 200 Gbps with low error rates. Notably, using a high-gain antenna, it reached speeds of 120 Gbps over a distance of 15 meters.
The chipset's true potential was revealed in a multiple-input multiple-output (MIMO) configuration, where four transmitters and four receivers worked independently. With each antenna handling a separate data stream, the total speed reached an impressive 640 Gbps.
This breakthrough technology, as Professor Okada notes, holds immense promise for various applications, including autonomous vehicles, remote healthcare, and immersive virtual reality experiences.
